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Qualcomm Snapdragon EUVDEUVD-2026-33845

| CVE-2026-24088 HIGH
Missing Authentication for Critical Function (CWE-306)
2026-06-01 qualcomm GHSA-frc8-35g4-52pf
8.2
CVSS 3.1 · Vendor: qualcomm
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Severity by source

Vendor (qualcomm) PRIMARY
8.2 HIGH
AV:L/AC:L/PR:H/UI:N/S:C/C:H/I:H/A:H

Primary rating from Vendor (qualcomm) · only source for this CVE.

CVSS VectorVendor: qualcomm

CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:C/C:H/I:H/A:H
Attack Vector
Local
Attack Complexity
Low
Privileges Required
High
User Interaction
None
Scope
Changed
Confidentiality
High
Integrity
High
Availability
High

Lifecycle Timeline

1
Analysis Generated
Jun 01, 2026 - 22:54 vuln.today

DescriptionCVE.org

Cryptographic Issue while processing a specific partition which allows unauthorized write access to load a customized bootloader.

AnalysisAI

Bootloader integrity bypass in Qualcomm Snapdragon platforms allows a high-privileged local attacker to write to a specific partition and load a customized (unsigned or tampered) bootloader, breaking the device's chain of trust. The flaw, reported by Qualcomm itself in its June 2026 security bulletin, carries a CVSS of 8.2 with scope change due to its impact on trusted firmware boundaries, and at the time of analysis there is no public exploit identified and the issue is not listed in CISA KEV.

Technical ContextAI

The underlying issue is a cryptographic weakness in how Snapdragon firmware validates or authenticates a particular boot partition before allowing write operations. CWE-306 (Missing Authentication for Critical Function) indicates that the partition-write/load path does not sufficiently verify the caller's authority or the cryptographic signature of the payload, which lets a privileged actor substitute a customized bootloader image. Affected products per the supplied CPE are Qualcomm Snapdragon application processors (cpe:2.3:a:qualcomm,_inc.:snapdragon:*), a System-on-Chip family broadly deployed in Android handsets, automotive platforms, IoT, and compute devices, meaning the bootloader is the root of trust for the entire device boot chain - once it is replaced, every higher-layer integrity check (verified boot, TEE attestation, OEM lock state) can be undermined.

RemediationAI

Apply the fix published in Qualcomm's June 2026 Security Bulletin (https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2026-bulletin.html) once the corresponding OEM firmware/bootloader update is released for your device model - patch available per vendor advisory, with exact patched build numbers determined by each OEM rather than a single upstream version string. Until the OEM update is installed, compensating controls include enforcing OEM-locked bootloader state and rejecting devices with unlock flags via MDM/attestation policy, requiring Play Integrity or platform remote-attestation checks before granting access to sensitive workloads (trade-off: breaks legitimately rooted developer devices), restricting physical access to high-value devices to defeat the AV:L precondition, and revoking trust for affected device models in attestation-gated services until firmware is updated (trade-off: user lockout). Do not rely on disabling features at the OS layer alone, since the flaw lives below the OS in the boot chain.

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EUVD-2026-33845 vulnerability details – vuln.today

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