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Qualcomm Snapdragon CVE-2026-24080

| EUVDEUVD-2026-52733 HIGH
Classic Buffer Overflow (CWE-120)
2026-08-04 qualcomm GHSA-xgf9-j687-mjhj
7.8
CVSS 3.1 · Vendor: qualcomm
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Severity by source

Vendor (qualcomm) PRIMARY
7.8 HIGH
AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
vuln.today AI
7.8 HIGH

Local vector confirmed by TA interface access; low privilege matches Android app execution context; full C/I/A reflects TEE memory corruption impact.

3.1 AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
4.0 AV:L/AC:L/AT:N/PR:L/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N

Primary rating from Vendor (qualcomm).

CVSS VectorVendor: qualcomm

Attack Vector
Local
Attack Complexity
Low
Privileges Required
Low
User Interaction
None
Scope
Unchanged
Confidentiality
High
Integrity
High
Availability
High

Lifecycle Timeline

2
Analysis Generated
Aug 04, 2026 - 16:09 vuln.today
CVE Published
Aug 04, 2026 - 15:07 cve.org
HIGH 7.8

DescriptionCVE.org

Memory Corruption when handling malformed request parameters in the fingerprint TA.

AnalysisAI

Memory corruption in Qualcomm Snapdragon's fingerprint Trusted Application (TA) allows a local low-privileged attacker to corrupt memory by sending malformed request parameters, resulting in full compromise of confidentiality, integrity, and availability. The vulnerability resides within the TrustZone Trusted Execution Environment (TEE), making successful exploitation particularly severe as it targets the secure world isolated from the Android normal world. No public exploit code and no CISA KEV listing have been identified at time of analysis, but the EPSS signal is absent from available data.

Technical ContextAI

The affected component is Qualcomm Snapdragon's fingerprint Trusted Application (TA), a firmware module that executes inside ARM TrustZone's Secure World TEE. TAs process sensitive biometric data and are invoked via a driver/SMC (Secure Monitor Call) interface from the Android normal world. CWE-120 (Classic Buffer Overflow) indicates that the TA fails to validate the size of request parameters before copying them into a fixed-size buffer, leading to memory corruption. The CPE string cpe:2.3:a:qualcomm,_inc.:snapdragon:*:*:*:*:*:*:*:* covers the broad Snapdragon product family. Because the TA executes in the secure enclave, successful memory corruption can undermine TEE isolation guarantees, potentially exposing biometric data or persistent cryptographic material stored exclusively in secure storage.

RemediationAI

The primary fix is to apply the firmware and driver updates distributed by Qualcomm through its August 2026 Security Bulletin at https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2026-bulletin.html. OEM partners (Samsung, OnePlus, Xiaomi, etc.) must integrate these patches into their own monthly security updates, so end-users should apply the latest OEM Android security patch for their device. An exact patched firmware version was not independently confirmed from the available reference data - consult the Qualcomm bulletin directly. As a compensating control where patching is not immediately possible, organizations managing a mobile device fleet should restrict sideloading of untrusted applications via MDM policy (disabling Unknown Sources), since exploitation requires local code execution; this reduces the attacker's ability to reach the fingerprint TA interface without eliminating the underlying flaw. Note that restricting application installation may impact device usability.

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CVE-2026-24080 vulnerability details – vuln.today

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