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Fastconnect 6700 Firmware CVE-2024-43047

HIGH
Use After Free (CWE-416)
2024-10-07 product-security@qualcomm.com
7.8
CVSS 3.1 · Vendor: qualcomm
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Severity by source

Vendor (qualcomm) PRIMARY
7.8 HIGH
AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Primary rating from Vendor (qualcomm) · only source for this CVE.

CVSS VectorVendor: qualcomm

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Attack Vector
Local
Attack Complexity
Low
Privileges Required
Low
User Interaction
None
Scope
Unchanged
Confidentiality
High
Integrity
High
Availability
High

Lifecycle Timeline

2
Added to CISA KEV
Jul 14, 2026 - 04:22 CISA
CVE Published
Oct 07, 2024 - 13:15 cve.org
HIGH 7.8

DescriptionCVE.org

Memory corruption while maintaining memory maps of HLOS memory.

AnalysisAI

Memory corruption while maintaining memory maps of HLOS memory. Rated high severity (CVSS 7.8), this vulnerability is low attack complexity. This Use After Free vulnerability could allow attackers to access freed memory to execute arbitrary code or crash the application.

Technical ContextAI

This vulnerability is classified as Use After Free (CWE-416), which allows attackers to access freed memory to execute arbitrary code or crash the application. Memory corruption while maintaining memory maps of HLOS memory. Affected products include: Qualcomm Fastconnect 6700 Firmware, Qualcomm Fastconnect 6800 Firmware, Qualcomm Fastconnect 6900 Firmware, Qualcomm Fastconnect 7800 Firmware, Qualcomm Qam8295P Firmware.

RemediationAI

A vendor patch is available. Apply the latest security update as soon as possible. Use smart pointers or garbage-collected languages. Set pointers to NULL after freeing. Enable memory sanitizers.

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CVE-2024-43047 vulnerability details – vuln.today

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