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Fastconnect 6700 Firmware CVE-2023-21624

MEDIUM
Information Exposure (CWE-200)
2023-07-04 product-security@qualcomm.com
5.5
CVSS 3.1 · NVD
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Severity by source

NVD PRIMARY
5.5 MEDIUM
AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N

Primary rating from NVD · only source for this CVE.

CVSS VectorNVD

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N
Attack Vector
Local
Attack Complexity
Low
Privileges Required
Low
User Interaction
None
Scope
Unchanged
Confidentiality
High
Integrity
None
Availability
None

Lifecycle Timeline

1
CVE Published
Jul 04, 2023 - 05:15 nvd
MEDIUM 5.5

DescriptionNVD

Information disclosure in DSP Services while loading dynamic module.

AnalysisAI

Information disclosure in DSP Services while loading dynamic module. Rated medium severity (CVSS 5.5), this vulnerability is low attack complexity. No vendor patch available.

Technical ContextAI

This vulnerability is classified as Exposure of Sensitive Information (CWE-200), which allows attackers to access sensitive data that should not be disclosed. Information disclosure in DSP Services while loading dynamic module. Affected products include: Qualcomm Fastconnect 6700 Firmware, Qualcomm Fastconnect 6800 Firmware, Qualcomm Fastconnect 6900 Firmware, Qualcomm Qam8255P Firmware, Qualcomm Qca6310 Firmware.

RemediationAI

No vendor patch is available at time of analysis. Monitor vendor advisories for updates. Minimize information in error messages, implement proper access controls, encrypt sensitive data at rest and in transit.

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CVE-2023-21624 vulnerability details – vuln.today

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