Skip to main content

Linux CVE-2026-80625

| EUVDEUVD-2026-67501
2026-08-28 Linux GHSA-q7c4-mw3p-rvrq

Lifecycle Timeline

1
CVE Published
Aug 28, 2026 - 06:48 cve.org
UNKNOWN (no severity yet)

DescriptionCVE.org

In the Linux kernel, the following vulnerability has been resolved:

RDMA/hns: Fix memory leak of bonding resources

In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hns_roce_hw_v2_exit() during driver removal, and then is allocated again in hns_roce_register_device() during driver reset. This leads to memory leak because the release timing has already passed. This may also lead to a kernel panic as below because of the leaked notifier callback:

Call trace: 0xffffa20fccc04978 (P) raw_notifier_call_chain+0x20/0x38 call_netdevice_notifiers_info+0x60/0xb8 netdev_lower_state_changed+0x4c/0xb8

As Sashiko suggested, the teardown order of bonding resources should be inverted to make sure the resources are released when the driver is removed.

Analysis

In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hns_roce_hw_v2_exit() during driver removal, and then is allocated again in hns_roce_register_device() during driver reset. This leads to memory leak because the release timing has already passed. …

Unlock full vulnerability intelligence

  • Risk assessment & exploitation conditions
  • Attack chain visualization
  • Remediation with exact patch versions
  • Threat intelligence from 22 sources
  • Personal watchlist & email alerts

Free forever · No credit card required

Threat intelligence, references, and detailed analysis are available after sign-in.

Share

CVE-2026-80625 vulnerability details – vuln.today

This site uses cookies essential for authentication and security. No tracking or analytics cookies are used. Privacy Policy