EUVD-2026-33848
GHSA-6gj5-936c-vhwv
Severity by source
AV:P/AC:L/PR:H/UI:N/S:C/C:H/I:H/A:H
Primary rating from Vendor (qualcomm) · only source for this CVE.
CVSS VectorVendor: qualcomm
CVSS:3.1/AV:P/AC:L/PR:H/UI:N/S:C/C:H/I:H/A:H
Lifecycle Timeline
1DescriptionCVE.org
Memory corruption while processing fastboot commands with improperly formatted input.
AnalysisAI
Memory corruption in Qualcomm Snapdragon fastboot bootloader processing allows a physically present attacker with high privileges to corrupt memory by submitting improperly formatted fastboot commands. The flaw carries a CVSS 7.2 score reflecting physical attack vector with scope change, and no public exploit identified at time of analysis. Disclosed in Qualcomm's June 2026 security bulletin, it affects Snapdragon platforms exposed during device provisioning, recovery, or firmware-flash workflows.
Technical ContextAI
The vulnerability resides in the fastboot protocol handler implemented in Qualcomm Snapdragon device firmware. Fastboot is a low-level protocol typically reached over USB while the device is in bootloader/recovery mode and is used to flash partitions, send commands, and provision devices. The root cause is classified as CWE-1286 (Improper Validation of Syntactic Correctness of Input) - the bootloader parser does not adequately validate the syntactic structure of incoming fastboot command arguments, allowing malformed input to corrupt memory (the 'Buffer Overflow' tag indicates the corruption manifests as out-of-bounds write/overflow conditions). The CPE string cpe:2.3:a:qualcomm,_inc.:snapdragon:*:*:* indicates the vulnerable code is part of the Snapdragon platform component set; specific chipset/firmware versions are enumerated in Qualcomm's June 2026 bulletin.
RemediationAI
Patch available per vendor advisory: apply the firmware updates referenced in Qualcomm's June 2026 Security Bulletin (https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2026-bulletin.html) once the corresponding OEM device firmware/OTA incorporating the fixed Snapdragon components is released; exact patched version strings are listed in that bulletin per chipset. Compensating controls while waiting for OEM rollout: keep bootloaders locked (do not OEM-unlock production devices), disable or restrict fastboot access in production builds (trade-off: complicates legitimate device recovery), enforce physical custody controls and tamper-evident sealing for sensitive devices (no functional trade-off but operational overhead), and in enterprise/MDM contexts block USB debugging and require attestation before re-enrollment (trade-off: slower field service workflows). For provisioning labs and supply-chain stations, restrict who can place devices into fastboot mode and audit fastboot session logs.
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External POC / Exploit Code
Leaving vuln.today