Sdm630 Firmware
CVE-2020-11133
HIGH
Severity by source
AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Primary rating from NVD · only source for this CVE.
CVSS VectorNVD
Lifecycle Timeline
1DescriptionNVD
u'Possible out of bound array write in rxdco cal utility due to lack of array bound check' in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MSM8998, QCS605, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SXR1130
AnalysisAI
u'Possible out of bound array write in rxdco cal utility due to lack of array bound check' in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MSM8998,. Rated high severity (CVSS 7.8), this vulnerability is low attack complexity. No vendor patch available.
Technical ContextAI
This vulnerability is classified as Buffer Copy without Size Check (CWE-120), which allows attackers to overflow a buffer to corrupt adjacent memory. u'Possible out of bound array write in rxdco cal utility due to lack of array bound check' in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MSM8998, QCS605, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SXR1130 Affected products include: Qualcomm Msm8998 Firmware, Qualcomm Qcs605 Firmware, Qualcomm Sda845 Firmware, Qualcomm Sdm630 Firmware, Qualcomm Sdm636 Firmware.
RemediationAI
No vendor patch is available at time of analysis. Monitor vendor advisories for updates. Always validate buffer sizes before copy operations. Use bounded functions (strncpy, snprintf). Enable compiler protections.
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View allSame technique Buffer Overflow
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External POC / Exploit Code
Leaving vuln.today