Ddr4 Sdram
CVE-2020-10255
CRITICAL
Severity by source
AV:N/AC:H/PR:N/UI:N/S:C/C:H/I:H/A:H
Primary rating from NVD · only source for this CVE.
CVSS VectorNVD
CVSS:3.1/AV:N/AC:H/PR:N/UI:N/S:C/C:H/I:H/A:H
Lifecycle Timeline
1DescriptionNVD
Modern DRAM chips (DDR4 and LPDDR4 after 2015) are affected by a vulnerability in deployment of internal mitigations against RowHammer attacks known as Target Row Refresh (TRR), aka the TRRespass issue. To exploit this vulnerability, the attacker needs to create certain access patterns to trigger bit flips on affected memory modules, aka a Many-sided RowHammer attack. This means that, even when chips advertised as RowHammer-free are used, attackers may still be able to conduct privilege-escalation attacks against the kernel, conduct privilege-escalation attacks against the Sudo binary, and achieve cross-tenant virtual-machine access by corrupting RSA keys. The issue affects chips produced by SK Hynix, Micron, and Samsung. NOTE: tracking DRAM supply-chain issues is not straightforward because a single product model from a single vendor may use DRAM chips from different manufacturers.
AnalysisAI
Modern DRAM chips (DDR4 and LPDDR4 after 2015) are affected by a vulnerability in deployment of internal mitigations against RowHammer attacks known as Target Row Refresh (TRR), aka the TRRespass. Rated critical severity (CVSS 9.0), this vulnerability is remotely exploitable, no authentication required. No vendor patch available.
Technical ContextAI
This vulnerability is classified under CWE-20. Modern DRAM chips (DDR4 and LPDDR4 after 2015) are affected by a vulnerability in deployment of internal mitigations against RowHammer attacks known as Target Row Refresh (TRR), aka the TRRespass issue. To exploit this vulnerability, the attacker needs to create certain access patterns to trigger bit flips on affected memory modules, aka a Many-sided RowHammer attack. This means that, even when chips advertised as RowHammer-free are used, attackers may still be able to conduct privilege-escalation attacks against the kernel, conduct privilege-escalation attacks against the Sudo binary, and achieve cross-tenant virtual-machine access by corrupting RSA keys. The issue affects chips produced by SK Hynix, Micron, and Samsung. NOTE: tracking DRAM supply-chain issues is not straightforward because a single product model from a single vendor may use DRAM chips from different manufacturers. Affected products include: Micron Ddr4 Sdram, Micron Lpddr4, Samsung Ddr4, Samsung Lpddr4, Skhynix Ddr4 Sdram.
RemediationAI
No vendor patch is available at time of analysis. Monitor vendor advisories for updates. Apply vendor patches when available. Implement network segmentation and monitoring as interim mitigations.
Same weakness CWE-20 – Improper Input Validation
View allSame technique Privilege Escalation
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External POC / Exploit Code
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